via waterjet-guided laser cutting producted parts with thickness of 2 mm

Precision cutting with water jet-guided laser

Excellent cutting edges, absence of burr, reduced heat input and the possibility to process very high aspect ratios are the main advantages of our waterjet-guided laser cutting against conventional laser cutting and drilling technology. The results achievable with clean cutting by SITEC are comparable to those of eroding processes.

 

The well-known process of waterjet guided laser cutting has been developed further by AVONISYS and has been successfully combined with the established laser machines of the LS series.

 

The cooperation between AVONISYS and SITEC resulted in a holistic system solution of technology and extensively automatable CNC laser machining systems. Due to their reliability and low cost of ownership fibre lasers are preferably used.

 

Benefits „clean cutting by SITEC“

  • burr-free precision cutting of very thin metal sheets and foils

  • burr-free and parallel separation of workpieces with a thickness of up to 20 mm, depending on the material

  • creation of drillings with extremely high aspect ratios

 

Materials

  • High-performance ceramics, such as silicon, silicon alloys and silicon carbides
  • Aluminum
  • Nickel alloys
  • Titanium and titanium alloys
  • Steel and stainless-steel alloys
  • Graphite in various forms
  • Minerals

 

The range of products and services includes technology development, the manufacture of CNC lasersystems from the LS series to fully automated, customized laser systems and series production at SITEC according to IATF16949.

 

 

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